Effect Of Sic And Tib2 Particles On Microstructure And Mechanical Properties Of Copper Surface Composites Fabricated By Friction Stir Processing

L. Suvarna, Raju and N., Ramakrishna and G., Mallaiah (2020) Effect Of Sic And Tib2 Particles On Microstructure And Mechanical Properties Of Copper Surface Composites Fabricated By Friction Stir Processing. Journal of Mechanics of Continua and Mathematical Sciences, 15 (7). pp. 507-516. ISSN 2454 -7190

[thumbnail of 53.pdf] Text
53.pdf
Restricted to Registered users only

Download (834kB) | Request a copy

Abstract

Pure copper is reinforced with 20µm ceramic particles like SiCp and TiB2 using FSP to fabiricate surface composites at constant rotational speed of 1120 revaluations per minutes and speed of the weld at 40mm/min. Cylindrical tapper threaded profile pin made of high carbon high chromium was used to prepare the
copper surface composites. Experiments were conducted on a vertical milling machine to prepare Surface composites by varying volume percentage of reinforcements (vol.%2, vol.%4,vol.%6). six combinations of surface composites
Cu/2vol.%SiC, Cu/4vol.%Sic, Cu/6vol.%Sic; Cu/2vol.%TiB2, Cu/4vol.%TiB2 and Cu/6vol.%TiB2 were fabricated. The processed composites were examined by using and optical microscope to reveal the microstructure. At 4 vol. % sic particles and 4vol.% of TiB2 particles the microstructure reveals fine grains (equiaxed) at the processed region as compared with 2&6 vol.% of reinforcements. Mechanical tests were conducted to determine ultimate tensile strength, yield strength. Hardness
survey was made on the processed sample and base metal. From the results, it is found that at 4 vol. % of SiC and 4 vol.% of TiB2 superior properties were obtained as that of vol.% 2 and vol.% 6 of reinforcements. This is attributed to the fine grains
formed in the copper surface composites. Cu surface composite reinforced with 6 vol.% of TiB2 resulted in higher hardness. As the vol. % of SiC and TiB2 increased the resistance to wear is also increased

Item Type: Article
Subjects: AC Rearch Cluster
Depositing User: Unnamed user with email techsupport@mosys.org
Date Deposited: 08 Dec 2023 09:05
Last Modified: 08 Dec 2023 09:05
URI: https://ir.vignan.ac.in/id/eprint/445

Actions (login required)

View Item
View Item